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Passion for Problem-Solving Leads the Way to Next-Generation Heat Dissipation Materials - Kenji Nishitani, CEO of U-MAP
As heat dissipation in electronic devices becomes an increasingly critical issue with the proliferation of data centers, EVs, and AI, we spoke with Kenji Nishitani, CEO of U-MAP, about his entrepreneurial journey, the company's unique materials technology, and his vision for the future of Japanese manufacturing.
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