Passion for Problem-Solving Leads the Way to Next-Generation Heat Dissipation Materials - Kenji Nishitani, CEO of U-MAP
As heat dissipation in electronic devices becomes an increasingly critical issue with the proliferation of data centers, EVs, and AI, we spoke with Kenji Nishitani, CEO of U-MAP, about his entrepreneurial journey, the company's unique materials technology, and his vision for the future of Japanese manufacturing.
March 26, 2025
March 19, 2025